Assembly
SMD / THT
We assemble prototypes and small-medium series of electronic boards with SMD and THT technology, directly in our Italian facility.
The process starts by uploading your BOM to the WEP platform. Our sourcing engine queries Mouser, Farnell, DigiKey and TME in real time to find components at the best available price. After quote confirmation, components are procured, the stencil prepared and the board assembled with reflow oven soldering or selective soldering for through-hole components.
0402, 0201, QFN, BGA, LGA, SOP, TQFP e più
Connectors, transformers, radial and axial components
Mouser · Farnell · DigiKey · TME
Production and quality control in Italy
How it works
Import the bill of materials in XLS, CSV or Excel format. The WEP tool automatically normalizes part numbers.
The engine queries in real time the 4 main distributors and returns updated availability and prices.
Ricevi il preventivo completo (componenti + assemblaggio) e conferma l'ordine direttamente online.
The assembled boards are delivered as quickly as possible with full quality control.
Inspection
X-Ray
L'ispezione a raggi X è indispensabile per verificare la qualità delle saldature nei componenti nascosti come BGA, LGA, QFN e connettori press-fit, dove il controllo visivo è impossibile.
The X-Ray system analyzes every solder joint in 2D and 3D, detecting voids, solder bridges, short circuits and missing or misplaced components. The result is a detailed report with radiographic images and automatic pass/fail evaluation.
- BGA, LGA, QFN, CSP and hidden component analysis
- Rilevamento void nelle saldature (% per normativa)
- 2D analysis and 3D CT tomography
- Report with images and IPC-A-610 classification
- Real-time online quote (Business+ plan)
Quando usare l'X-Ray
Componenti con ball array sotto il package: l'unico modo per verificare ogni saldatura è la radiografia.
Automotive, medical, aerospace: regulations require radiographic inspection on all critical joints.
Prima messa in produzione: l'X-Ray valida il profilo di rifusione e i parametri di stampa dello stencil.
AOI
Automated Optical Inspection
L'AOI (Automated Optical Inspection) è il sistema di controllo visivo automatizzato che verifica ogni componente sulla scheda tramite telecamere ad alta risoluzione e luce strutturata multiangolo.
Il sistema confronta la scheda assemblata con il golden board di riferimento, identificando componenti mancanti, polarità errata, tombstoning, saldature a ponte, eccesso di stagno e difetti di serigrafia. La copertura è del 100% della superficie ispezionabile.
- Copertura 100% dei componenti SMD ispezionabili
- Detection: tombstoning, shift, wrong polarity, missing components
- Automatic report with high-resolution images
- Lot number traceability
- Available in the Performance plan
Types of defects detected
ICT
In-Circuit Testing
The in-circuit test electrically verifies every component on the board through a "bed of nails" fixture that contacts the test nodes defined in the project.
A differenza dell'ispezione visiva, l'ICT misura i valori reali: resistenze, capacità, induttanze, continuità di rete, cortocircuiti e circuit aperti. Ogni componente viene confrontato con i valori di tolleranza definiti. Il risultato è un verdetto pass/fail per ogni nodo, con identificazione precisa del guasto.
- R, C, L measurement with configurable tolerance
- Network continuity and short circuit verification
- Active component testing (diodes, transistors, IC boundary scan)
- Report with exact fault location
- Real-time online quote (Performance plan)
ICT test phases
We build the test fixture from the Gerber file and the project netlist.
We write the test program with the tolerances defined by the BOM and schematic.
Every board is tested individually. The report shows pass/fail per node with graphical fault location.
Rework
Professional repair
Il servizio di rework permette la sostituzione di componenti difettosi o obsoleti su schede già assemblate, senza dover smaltire o riacquistare l'intero lotto.
We use precision BGA rework stations with thermal control for the removal and reattachment of fine-pitch and BGA components. Every operation is followed by X-Ray inspection to certify the quality of the new solder joint.
- BGA, QFN, LGA, TQFP, connector replacement
- BGA reballing with new solder balls
- Custom thermal profiling for each component
- X-Ray inspection post rework included
- Real-time online quote (Business+ plan)
When rework is worthwhile
A single defective chip does not justify scrapping the entire board.
Replacement of a microcontroller or RF module with an updated version on existing lots.
Boards returned for failure: diagnosis, faulty component replacement and re-test.
Production
PCB
Production of single and multilayer printed circuit boards, standard or high-Tg FR4, with HASL, ENIG, OSP or Immersion Tin surface finish.
Upload your Gerber files (or ODB++) directly to the WEP platform and receive an instant quote. The integrated CAD Viewer lets you view and verify every layer before order confirmation, eliminating costly mistakes.
- Single, double layer and multilayer PCB (up to 12 layers)
- Finishes: HASL, ENIG (electroless nickel gold), OSP, Immersion Tin
- Materials: FR4, FR4 high-Tg, Rogers, Flex (polyimide)
- CAD Viewer: verify ODB++, Gerber, IPC-2581 before ordering
- Instant online quote on all plans
Integrated CAD Viewer
Load ODB++, Gerber RS-274X, IPC-2581 or GenCAD. The viewer shows each colored layer, with zoom, measure, mirror and visibility toggle. Verify before ordering.
Which plan includes your service?
All plans include assembly and PCB production. Inspection and testing services require a Business+ or Performance plan.
| Service | Free | Business+ | Performance |
|---|---|---|---|
| SMD/THT Assembly | |||
| PCB Production | |||
| X-Ray | |||
| Rework | |||
| AOI | |||
| ICT | |||
| Order discount |